Flexible Board - Company Ranking(7 companyies in total)

Last Updated：Aug 13, 2025 Aggregation Period:Jul 16, 2025〜Aug 12, 2025
This ranking is based on the number of page views on our site.

Company Name	Company information	Featured Products
Company Name	Company information	Product Image, Product Name, Price Range	overview	Application/Performance example
キヤノン・コンポーネンツ電子回路事業部	Address Saitama/ number of employees 1102 Business Activities ○Electronic Circuit Business ○CIS Business ○IJC Business ○Medical Device Business Key Partners	Interposer flexible substrate Other	Ball-Pitch 0.4mm Pitch BGA compatible Multilayer flex, 3 layers (double-sided flex + single-sided stacked) Minimum L/S 25μm/25μm (chip mounting layer) Total thickness below 100μm FPC processing, reel-to-reel continuous processing	Semiconductor package
		TAB flexible substrate Other	<Basic Specifications> Maximum product installation area: 143 (W) × 142 (L) mm Base film thickness: 25 μm or more Wiring copper thickness: 35 μm or less Pattern protection: Coverlay film specification Surface treatment: Ni/Au plating (Ni 3 μm or less / Au 1 μm or less) Inner lead/wiring width: Inner lead 80 μm / wiring width 50 μm (depends on copper thickness)	For more details, please contact us or download the catalog.
		TAB flexible substrate Other	【Specifications】 ○ Maximum product placement area: 143 (W) × 142 (L) mm ○ Base film thickness: 25 μm or more ○ Wiring copper thickness: 35 μm or less ○ Pattern protection: Coverlay film specification ○ Surface treatment: Ni/Au plating (Ni 3 μm or less / Au 1 μm or less) ○ Inner lead/wiring pitch: Inner lead 80 μm / wiring 50 μm 　　　　　　　　　　　　　　(*Dependent on copper thickness) ● For more details, please contact us or download the catalog.	For more details, please contact us or download the catalog.
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キヤノン・コンポーネンツ電子回路事業部

Address

Saitama/

number of employees

1102

Business Activities

○Electronic Circuit Business ○CIS Business ○IJC Business ○Medical Device Business

Key Partners

Featured Products

Interposer flexible substrate

overview

Ball-Pitch 0.4mm Pitch BGA compatible Multilayer flex, 3 layers (double-sided flex + single-sided stacked) Minimum L/S 25μm/25μm (chip mounting layer) Total thickness below 100μm FPC processing, reel-to-reel continuous processing

Application/Performance example

Semiconductor package

TAB flexible substrate

overview

<Basic Specifications> Maximum product installation area: 143 (W) × 142 (L) mm Base film thickness: 25 μm or more Wiring copper thickness: 35 μm or less Pattern protection: Coverlay film specification Surface treatment: Ni/Au plating (Ni 3 μm or less / Au 1 μm or less) Inner lead/wiring width: Inner lead 80 μm / wiring width 50 μm (depends on copper thickness)

Application/Performance example

For more details, please contact us or download the catalog.

TAB flexible substrate

overview

【Specifications】 ○ Maximum product placement area: 143 (W) × 142 (L) mm ○ Base film thickness: 25 μm or more ○ Wiring copper thickness: 35 μm or less ○ Pattern protection: Coverlay film specification ○ Surface treatment: Ni/Au plating (Ni 3 μm or less / Au 1 μm or less) ○ Inner lead/wiring pitch: Inner lead 80 μm / wiring 50 μm 　　　　　　　　　　　　　　(*Dependent on copper thickness) ● For more details, please contact us or download the catalog.

Application/Performance example

For more details, please contact us or download the catalog.
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Address

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Business Activities

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Flexible Board - Company Ranking(7 companyies in total)

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