Flexible Board - Company Ranking(7 companies in total)
Last Updated： Aggregation Period:Sep 17, 2025〜Oct 14, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Ball-Pitch 0.4mm Pitch BGA compatible Multilayer flex, 3 layers (double-sided flex + single-sided stacked) Minimum L/S 25μm/25μm (chip m... | Semiconductor package | ||
TAB flexible substrate
Other |
【Specifications】 ○ Maximum product placement area: 143 (W) × 142 (L) mm ○ Base film thickness: 25 μm or more ○ Wiring copper thickness: 35 μ... | For more details, please contact us or download the catalog. | |
TAB flexible substrate
Other |
<Basic Specifications> Maximum product installation area: 143 (W) × 142 (L) mm Base film thickness: 25 μm or more Wiring copper thickness: 3... | For more details, please contact us or download the catalog. | |
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キヤノン・コンポーネンツ 電子回路事業部
-
- Featured Products
-
Interposer flexible substrate
- overview
- Ball-Pitch 0.4mm Pitch BGA compatible Multilayer flex, 3 layers (double-sided flex + single-sided stacked) Minimum L/S 25μm/25μm (chip m...
- Application/Performance example
- Semiconductor package
TAB flexible substrate
- overview
- 【Specifications】 ○ Maximum product placement area: 143 (W) × 142 (L) mm ○ Base film thickness: 25 μm or more ○ Wiring copper thickness: 35 μ...
- Application/Performance example
- For more details, please contact us or download the catalog.
TAB flexible substrate
- overview
- <Basic Specifications> Maximum product installation area: 143 (W) × 142 (L) mm Base film thickness: 25 μm or more Wiring copper thickness: 3...
- Application/Performance example
- For more details, please contact us or download the catalog.
-
キヤノン・コンポーネンツ 電子回路事業部
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